Chemistry Collaboration Is a Critical Component to Supporting Semiconductor WLP Mobility, Market and Applications Demands
Posted 10/12/2015 by by Eric Gongora, Global Director, Enthone Semiconductor Product Marketing
Semiconductor wafer level packaging (WLP) continues to grow. Increased demand for mobility with more memory, emerging markets (Iot, Sensors, wearables), as well as the continued expansion of WLP use in automotive, LED and other applications require products to be smaller, perform better, cost less and last longer. This growth is driven by shrinking wafer nodes, smaller footprints, increased electrical and thermal performance requirements.
WLP chemistry is a critical component in helping wafer foundries, OEMs and IDMs address the ever-changing industry landscape. In this “advanced packaging world,” there are fewer and fewer off- the-shelf solutions. WLP designs are requiring specific electroplated copper features to support integration schemes.
Merchant and captive bumping operations are shifting from conventional chemistries that have traditionally been employed to support a variety of electroplated features, to processes that are specially formulated to meet specific designs, applications and tools. The development of next generation process chemistry requires close collaboration amongst the entire supply chain.
Enthone is uniquely positioned to support the integration between Front-end wafer fabrication and Back-end assembly processes. As a technology company committed to addressing current and emerging application requirements, we provide chemistries optimized to meet your specific design and tool capabilities.
By establishing strategic partnerships with leading equipment and material suppliers, we continuously co-develop advanced chemistries demanded by today's highly competitive semiconductor market. This collaborative model enables us to accelerate product development for shortest time to market, while also meeting environmental, health and safety concerns that align with your company's technology.