Connectors & Leadframes
Enthone technologies for connectors and leadframes meet the growing demand for finer feature dimensions and smaller package sizes with higher performance. Each process reduces metal consumption, equipment maintenance and total cost of ownership while increasing productivity. Our solutions include:
- High efficiency gold processes
- Whisker-resistant pure tin and tin-lead processes
- High speed silver and environmentally sound post-treatments that enhance tarnish resistance
- High-yield palladium-nickel that provides exceptional contact stability and superior wear resistance.
Additionally, Enthone’s electroplating processes specially engineered for Molded Interconnect Devices (MID) deliver consistent performance and uniform deposits. These high-efficiency processes reduce chemical consumption and raise throughput.