Semiconductor Materials & Packaging
Enthone technologies for semiconductor materials and packaging meet and exceed the ever-changing demands of the semiconductor industry.
Our ViaForm® copper damascene chemistry for wafer fabrication allow the manufacture of shrinking device geometries down to 14 nm and enable greater memory and logic device reliability, and allows chip manufacturers to achieve higher yields through a reduction in post-plating defects. In addition, our wafer level packaging technologies, which include bump, copper pillar and through-silicon via (TSV), extend equipment productivity by lessening the need for costly capital equipment investments. These processes also meet emerging 3-D packaging as an alternative to flip-chip devices.