Applications

Supporting Data

ENPLATE® LDS

Processes for MIDs

ENPLATE® LDS plating systems are specially formulated processes for Molded Interconnect Device (MID) applications. These high-throughput processes are highly tolerant to contaminants, resulting in consistent performance and uniform deposits.

ENPLATE LDS Processes Create Value.

  • Lower Chemistry Consumption: The high-efficiency processes use significantly less proprietary chemistry versus traditional MID processes.
  • Decrease Energy and Labor Use: High deposition rates decrease running costs.
  • Molded Interconnect DevicesQuick Delivery: Reduces inventories and enables easier supply management.
  • Increase Yields: Reliable coating performance eliminates poor adhesion and skip plating.
  • Raise Throughput: Higher productivity delivers substantially higher throughput.
  • Improve Efficiency: High deposition rate increases efficiency by as much as 40%.

ENPLATE LDS processes are available for LDS and two-shot MID applications. Specific products include the following:

ENPLATE® LDS Process Description

ENPLATE LDS Cleaners and Activators

  • Provide debris removal, as well as etch and activate surfaces to ensure excellent adhesion
ENPLATE LDS NI Series
  • Mid-phosphorous, cadmium- and lead-free electroless nickel processes
  • High efficiency, increased throughput
  • Reliable coating reduces rejects and decreases cost of ownership
ENPLATE LDS CU-400 SC
  • Formulated for fine line plating, as well as antennas
  • Single- or two-step operation, based on substrate and application
  • Potential to eliminate copper strike
  • High stability, high efficiency
  • Cyanide-free
ENPLATE LDS AU Series
  • Reliable immersion gold processes
  • Low gold content reduces costs
  • Long bath life, high stability
  • Superior corrosion and wear resistance
ENPLATE LDS AG-600
  • High-efficiency immersion silver
  • Exceptional corrosion resistance and electrical performance
  • Ideal drop-in ENIG replacement
  • Cyanide-free, non allergenic
  • Post-treatments enhance the already exceptional tarnish resistance

Please refer to the Supporting Data section for detailed process cycles.