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LECTRO-NIC®

Sulfamate Nickel Processes

LECTRO-NIC® sulfamate nickel processes are engineered for high-speed, reel-to-reel applications. The processes are specially formulated for connectors, leadframes and a variety of semiconductor devices. 

LECTRO-NIC OXR-1300
LECTRO-NIC OXR-1300 is specially formulated to prevent discoloration of plated STANNOSTAR® pure tin deposits during reflow and high temperature thermal bake conditions. Used as part of a STANNOSTAR matte or bright tin MSA-based system, the process maintains excellent solderability and delivers superior operating flexibility with a robust performance. It enables reliable and low-cost lead-free finish implementation, without additional process steps or new equipment requirements. 

Achieving discoloration resistance has long been an industry challenge because pure tin finishes are much more prone than tin-lead finishes to oxidation when exposed to elevated temperatures. Furthermore, the implementation of lead-free solders in the PWB assembly process has forced the reflow temperatures to increase substantially. LECTRO-NIC OXR-1300 provides a reliable, high-yield solution to this issue. 

In addition to preventing oxidation, LECTRO-NIC OXR-1300 provides a diffusion barrier that hinders whisker growth. Its semi-bright deposits also provide a consistent, uniform appearance, and its high-speed deposition is ideal for reel-to-reel applications.

LECTRO-NIC 10-03 HSX
LECTRO-NIC 10-03 HSX is a sulfamate type nickel electroplating formulation specifically designed for high speed plating in reel-to-reel equipment using soluble anodes. Its low sulfur content produces slightly compressive stressed, semi-bright, and ductile nickel deposits. 

The stable, fully analyzable process provides a laminar deposit structure. It is ideally suited as an undercoat for precious or non-precious metal deposits.