Newsroom

MacDermid Enthone Automotive Summit Draws Record Attendance

July 1, 2016
Suzhou, China, June 15-16, 2016 - MacDermid Enthone Industrial Solutions recently hosted an Automotive Technology Summit.  The two day event drew more than 600 delegates from major OEM’s and tier suppliers (comprising a total of 139 companies) from Greater China, Japan, Korea, India and SEA, who participated in a very open and constructive dialog related to Anti-Corrosion, Decorative, Plating on Plastics and Metallurgical Coatings.

HDP User Group Announces MacDermid Enthone Electronics Solutions as its Newest Member

March 23, 2016
Cave Creek, Arizona, USA March 23, 2016 - The High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce that MacDermid Enthone Electronics Solutions has become a member.
Event Name Event Date Event Location
SMTA International Sept. 25 - 29, 2016 Rosemont, IL
USA