Enthone Publishes OSP Performance Guide
Increases in Yields, Quality, and Reliability Verified.
WEST HAVEN, Connecticut, USA, August 14, 2013– Enthone recently published an Organic Solderability Preservative (OSP) Performance Guide that enables OEMs, EMS, and printed circuit board (PCB) fabricators to easily determine how yields, quality and reliability can be significantly increased throughout the supply chain, while dramatically reducing rework and rejects. Specifically, the guide provides compelling data comparing the industry’s leading OSP process, ENTEK® PLUS HT, with other established and black market OSPs.
As detailed in the guide, ENTEK PLUS HT delivers exceptional wetting capability by as much as 60% when compared with competitive OSPs. Furthermore, the wetting is faster with a substantially higher maximum force (mN/mm); both properties are industry accepted as being key indicators to providing enhanced copper protection and solderability. Additional test results on wave soldering hole fill performance, visual appearance after multiple lead-free reflows, ICT reliability and ball shear strength are also detailed within the guide.
Available in both English and Simplified Chinese, the ENTEK PLUS HT OSP Performance Guide may be requested by emailing email@example.com. To verify your OSP process, please visit http://enthone.com/ENTEK_PLUS_HT .
Enthone Inc., an Alent plc company, is a global and leading supplier of high performance specialty chemicals and coatings. Enthone creates customer value by providing innovative and cost-effective technology solutions to the automotive, building hardware, energy, aerospace, jewelry, industrial finishes, printed circuit board and semiconductor industries. For more information, please visit enthone.com.